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Electrolube Debut New Surface Mount Products in China

Zamieszczone na 25/06/13
Tags: New Product, Conference, China

Assembly materials manufacturer, Electrolube, will launch new surface mount adhesives and thermal pads to the Chinese market at DEX Electronic & Laser Exhibition in Shenzhen, on the 18th-20th July. Electrolube will also use the show as a platform to highlight the latest advances in specialist chemicals for the Chinese electronics industry. Renowned for being experts in conformal coatings, the company will also feature next generation solutions from their core product groups, which include thermal management, cleaning solutions, maintenance and service aids, contact lubricants, conformal coatings and resins.

New additions to Electrolube's Surface Mount range include ESLE-10, a one-part silver loaded epoxy resin, and ES501 underfill resin. ESLE-10 provides excellent adhesion and is used as a conductive bond between solder-free surface mount connections, solder repairs, static discharge and grounding or general conductive adhesion. ES501 underfill resin improves adhesion strength of devices during mechanical stress. The resin provides fast, void-free underfill of area array devices without compromising thermal cycle performance. With its high flexibility, ES501 can be easily reworked and used in high-volume assembly, offering a typical cure time of 35-40 minutes at 90°C or 3 minutes at 150°C.

ES808, also a new Surface Mount Adhesive that will feature at DEX, demonstrates high wet strength and good electrical characteristics and offers outstanding bonding performance of surface mounted devices to printed circuit boards prior to wave soldering. Where medium to high dispense speeds and high dot profiles are required, ES808 provides users with a cost effective solution and ease of use with its cartridge format. Suitable for pin transfer and stencil print, ES808 offers excellent resistance against humidity. Equally, the new ES807 offers the same level of performance but is more suited for high speed dispensing (25,000-50,00DPH) and provides an outstanding dot profile. Both products have excellent adhesion to substrate and wet strength and have a typical cure temperature of 130°C and 90 second cure time or 60 seconds at 150°C.

Electrolube's management and technical team will be available on stand 6F06 to discuss the benefits of their extensive product range and help identify solutions for visitors with specific electronic and manufacturing requirements.